· Semiconductor wafer inspection(반도체 웨이퍼 검사)
· Surface and bump inspection
· Electronics manufacturing(전자 제조)
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection(태양광 패널 검사)
· General machine vision(일반 머신비전)
· ETC.
Family | Genie Nano |
---|---|
Partnumber | G3-XM30-M4095 |
Resolution | 16.8 Megapixel |
Resolution(H*V) | 4096 x 4096 pixel |
Sensor | Onsemi Python 16k |
Sensor size(Image Circle) | 26.07 mm |
Sensor Format(Inch) | APS-H |
Turbodrive Frame Rate | |
Frame Rate | 120 fps |
Pixel Size | 4.5 μm |
Interface | CoaXPress (CXP-6) |
Chroma | Mono |
Readout Method | Global |
Dynamic Range | 55.3 dB |
Sensor type | CMOS |
Mount | M42 |
Size | 59 x 59 x 32 mm |
Maker | Teledyne Dalsa |
구분 | 파일명 | 다운로드 |
---|---|---|
카달로그 | [2024년] 앤비젼 전제품 카달로그 | |
데이터시트 | Genie Nano CXP Family Datasheet | |
매뉴얼 | Genie Nano CXP Manual |