

· Semiconductor wafer inspection
· Surface and bump inspection
· Electronics manufacturing
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection
· General machine vision
· And more!

| Family | Genie Nano |
|---|---|
| Partnumber | G3-XM32-M5105 |
| Resolution | 26.2 Megapixel |
| Resolution(H*V) | 5120 x 5120 pixel |
| Sensor | OnSemi PYTHON 25K |
| Sensor size(Image Circle) | 32.58 mm |
| Sensor Format(Inch) | APS-H |
| Turbodrive Frame Rate | |
| Frame Rate | 80 fps |
| Pixel Size | 4.5 μm |
| Interface | CXP-6 |
| Spectrum | Mono+NIR |
| Readout Method | Global |
| Dynamic Range | 55.3 dB |
| Sensor type | CMOS |
| Mount | M42 |
| Size | 59 x 59 x 32 mm |
| Maker | Teledyne Dalsa |