

· Semiconductor wafer inspection
· Surface and bump inspection
· Electronics manufacturing
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection
· General machine vision
· And more!

| Family | Genie Nano |
|---|---|
| Partnumber | G3-XM01-M8205 |
| Resolution | 67.1 Megapixel |
| Resolution(H*V) | 8192 x 8192 pixel |
| Sensor | Teledyne e2v Emerald 67M |
| Sensor size(Image Circle) | 28.96 mm |
| Sensor Format(Inch) | APS-C |
| Turbodrive Frame Rate | |
| Frame Rate | 30 fps |
| Pixel Size | 2.5 μm |
| Interface | CXP-6 |
| Spectrum | Mono |
| Readout Method | Global |
| Dynamic Range | 62 dB |
| Sensor type | CMOS |
| Mount | M42 |
| Size | 32 x 59 x 59 mm |
| Maker | Teledyne Dalsa |