· Semiconductor wafer inspection
· Surface and bump inspection
· Electronics manufacturing
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection
· General machine vision
· And more!
Family | Genie Nano |
---|---|
Partnumber | G3-XM01-M8205 |
Resolution | 67.1 Megapixel |
Resolution(H*V) | 8192 x 8192 pixel |
Sensor | Teledyne e2v Emerald 67M |
Sensor size(Image Circle) | 28.96 mm |
Sensor Format(Inch) | APS-C |
Turbodrive Frame Rate | |
Frame Rate | 30 fps |
Pixel Size | 2.5 μm |
Interface | CoaXPress6 |
Chroma | Mono |
Readout Method | Global |
Dynamic Range | 62 dB |
Sensor type | CMOS |
Mount | M42 |
Size | 32 x 59 x 59 mm |
Maker | Teledyne Dalsa |