· Semiconductor wafer inspection
· Surface and bump inspection
· Electronics manufacturing
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection
· General machine vision
· And more!
Family | Genie Nano |
---|---|
Partnumber | G3-XC01-C6205 |
Resolution | 37.7 Megapixel |
Resolution(H*V) | 6144 x 6144 pixel |
Sensor | Teledyne E2V Emerald 36M Color |
Sensor size(Image Circle) | 21.72 mm |
Sensor Format(Inch) | 4/3" |
Turbodrive Frame Rate | |
Frame Rate | 43 fps |
Pixel Size | 2.5 μm |
Interface | CoaXPress |
Chroma | Color |
Readout Method | Global |
Dynamic Range | 66 dB |
Sensor type | CMOS |
Mount | M42 |
Size | 32 x 59 x 59 mm |
Maker | Teledyne Dalsa |